电子元件与材料2026，Vol.45Issue(3)：357-364,8.DOI:10.14106/j.cnki.1001-2028.2026.1372
金属化薄膜电容器电热耦合仿真与温升影响因素研究
Study on electro-thermal coupling simulation and temperature rise influencing factors of metallized film capacitors
摘要
Abstract
Metallized film capacitors are widely used in inverters for new energy power generation systems,ultra-high voltage direct current converter stations,electric vehicle controllers,and pulsed power equipments for electromagnetic energy weapons.The temperature rise issue during operation directly affects their service reliability and lifespan.To investigate the influencing factors of temperature rise in metallized film capacitors,this study took the DC-link support capacitor for new energy vehicles as the research object and established a thermoelectric coupling simulation model based on the COMSOL Multiphysics platform.The effects of different operating conditions,material parameters and capacitor structures on the temperature rise of capacitors were simulated.The results indicated that the ripple current,equivalent series resistance(ESR),and ambient temperature all exerted significant impacts on the temperature distribution and overall temperature rise of the capacitor.This study provides a method to reduce the capacitor's temperature rise by utilizing the high thermal conductivity of packaging materials.These findings provide a reference for the structural optimization design and temperature rise suppression of metallized film capacitors.关键词
金属化薄膜电容器/COMSOL Multiphysics/电热耦合/温升Key words
metallized film capacitor/COMSOL multiphysics/electro-thermal coupling/temperature rise引用本文复制引用
张天栋,毛林豹,殷超,迟庆国..金属化薄膜电容器电热耦合仿真与温升影响因素研究[J].电子元件与材料,2026,45(3):357-364,8.基金项目
智能电网国家科技重大专项(2030)资助(2025ZD0808600) （2030）
