电子与封装2026，Vol.26Issue(3)：3-13,11.DOI:10.16257/j.cnki.1681-1070.2026.0069
热电器件集成电子封装的数值模拟研究:方法、应用与未来方向
Numerical Simulation Study on Integrated Electronic Packaging of Thermoelectric Devices:Methods,Applications,and Future Directions
摘要
Abstract
With the continuous development of electronic devices toward higher power density and miniaturization,thermal management challenges have become increasingly critical.Thermoelectric devices,which possess both waste heat recovery and active cooling capabilities,are considered highly promising energy conversion and thermal management solutions for modern compact electronic packaging.Regarding numerical simulation methods for thermoelectric device-integrated electronic packaging,existing studies primarily rely on key techniques such as finite element analysis,multi-physics coupling analysis,and molecular dynamics simulations to investigate and evaluate device performance in thermal management,interfacial reliability,and structural optimization.However,current numerical simulation approaches still face several challenges,including limited model accuracy,high computational cost,and difficulties in capturing multiscale characteristics.Future research could focus on integrating artificial intelligence-assisted simulation and multiscale modeling to further enhance the accuracy and efficiency of thermoelectric device-integrated electronic packaging simulations.关键词
热管理/电子封装/热电器件/界面效应/数值模拟Key words
thermal management/electronic packaging/thermoelectric device/interface effect/numerical simulation分类
信息技术与安全科学引用本文复制引用
张万田,袁恒,逯瑶..热电器件集成电子封装的数值模拟研究:方法、应用与未来方向[J].电子与封装,2026,26(3):3-13,11.基金项目
国家重点研发计划(2025YFE0126500) （2025YFE0126500）
国家自然科学基金青年基金(52402232) （52402232）
广东省基础与应用基础研究基金区域联合基金青年基金(2023A1515110512) （2023A1515110512）
松山湖材料实验室开放课题(2023SLABFN15) （2023SLABFN15）
南方科技大学科研启动配套项目(Y01796223) （Y01796223）
