电子与封装2026，Vol.26Issue(3)：14-22,9.DOI:10.16257/j.cnki.1681-1070.2026.0070
高低温环境下多层片式陶瓷电容器板弯失效分析
Flexural Failure Analysis of Multilayer Ceramic Capacitors Under High and Low Temperature Conditions
摘要
Abstract
Multilayer ceramic capacitors(MLCCs)are currently among the most widely used passive components.Excessive bending of printed circuit boards can cause fracture of the brittle ceramic dielectric within MLCCs,where crack propagation through the internal electrodes may result in electrical short circuits.To investigate this failure phenomenon,the solder geometries are accurately generated using Surface Evolver and the active region of the MLCCs is simplified using a composite material homogenization method.A three-dimensional thermo-mechanical coupled finite element model(FEM)is developed to simulate the bending stress distribution of three types of MLCCs under five temperature conditions(-25,0,25,50,80 ℃).In addition,bending experiments under high and low temperature conditions are conducted.The experimental results show good agreement with the FEM predictions in terms of both failure strain and crack initiation locations,validating the accuracy of the FEM.The study result indicates that,compared with high temperature conditions,MLCCs are more prone to cracking at low temperatures and exhibit smaller bending failure strains.关键词
多层片式陶瓷电容器/板弯失效/高低温环境/开裂失效Key words
multilayer ceramic capacitor/flexural failure/high and low temperature conditions/crack failure分类
信息技术与安全科学引用本文复制引用
孙佳琛,杨森,徐琴,沈飞,柯燎亮..高低温环境下多层片式陶瓷电容器板弯失效分析[J].电子与封装,2026,26(3):14-22,9.基金项目
国家自然科学基金重点项目(12332006) （12332006）
