电子与封装2026，Vol.26Issue(3)：46-52,7.DOI:10.16257/j.cnki.1681-1070.2026.0085
基于边的光滑有限元法的封装模块电热力仿真研究
Electro-Thermo-Mechanical Simulation of Packaging Modules via Edge-Based Smoothed Finite Element Method
摘要
Abstract
With the evolution of power electronic devices towards higher power density,the reliability of packaging and interconnection is a key bottleneck restricting their service life and performance.In particular,for insulated gate bipolar transistor(IGBT)modules operating under high-current conditions,various reliability issues become even more pronounced.Among the series of smoothed finite element method(S-FEM)variants proposed by scholars in recent years,the edge-based smoothed finite element method(ES-FEM)features lower sensitivity to mesh distortion and superior temporal stability,and exhibits higher computational accuracy.ES-FEM is extended to the field of multi-physics coupling simulation,and a novel electro-thermo-mechanical simulation method is proposed.The effectiveness and efficiency of the proposed method are verified through comparative analysis with the finite element method(FEM)via numerical case studies of an IGBT module.The results demonstrate that,with identical mesh discretization,ES-FEM yields more accurate results than FEM.关键词
基于边的光滑有限元法/多物理场耦合/绝缘栅双极型晶体管Key words
edge-based smoothed finite element method/multi-physics coupling/insulated gate bipolar transistor分类
信息技术与安全科学引用本文复制引用
高方腾,陈沛,杨茗勋,秦飞..基于边的光滑有限元法的封装模块电热力仿真研究[J].电子与封装,2026,26(3):46-52,7.基金项目
北京市自然科学基金-小米创新联合基金(L233001) （L233001）
