电子与封装2026，Vol.26Issue(3)：73-89,17.DOI:10.16257/j.cnki.1681-1070.2026.0097
混合键合界面力学行为的多尺度仿真:研究进展与挑战
Multiscale Simulation of Mechanical Behavior at Hybrid Bonding Interfaces:Research Progress and Challenges
摘要
Abstract
Hybrid bonding has emerged as a critical interconnect method enabling high-density 3D heterogeneous integration.The mechanical reliability of its interfaces has a decisive impact on the performance and yield of advanced packaging devices.However,issues such as coefficient of thermal expansion(CTE)mismatch,warpage of ultra-thin wafers,and nanoscale interfacial defects often lead to severe stress concentration,interfacial delamination,and even structural failure.These have become the core factors limiting the large-scale application of hybrid bonding technology.The research progress of multiscale simulation approaches on the mechanical behavior of hybrid bonding interfaces is systematically reviewed.Modeling strategies spanning from the macroscopic continuum scale to the microscopic atomic scale are systematically organized,and the key issues and challenges encountered at each scale of investigation are highlighted.Furthermore,the emerging frontiers are discussed,including quantum-continuum coupled modeling,artificial intelligence(AI)-driven inverse process design,and digital twin-enabled closed-loop optimization.The deep integration of multiscale simulation with intelligent methodologies holds the promise of transforming hybrid bonding development from empirical trial-and-error toward a model-driven paradigm,thereby providing essential mechanical foundations for high-density integration in the post-Moore era.关键词
混合键合/界面力学/多尺度仿真/分子动力学/有限元方法/先进封装Key words
hybrid bonding/interfacial mechanics/multiscale simulation/molecular dynamics/finite element method/advanced packaging分类
信息技术与安全科学引用本文复制引用
蔡新添,舒朝玺,习杨,东芳,张适,严晗,刘胜,彭庆..混合键合界面力学行为的多尺度仿真:研究进展与挑战[J].电子与封装,2026,26(3):73-89,17.基金项目
湖北工业大学博士科研启动基金(XJ2024008301) （XJ2024008301）
湖北省教育厅科技研究项目(Q20233005) （Q20233005）
国家自然科学基金(T2527901,12272378) （T2527901,12272378）
