电子与封装2026，Vol.26Issue(3)：90-97,8.DOI:10.16257/j.cnki.1681-1070.2026.0108
集成电路三维封装力学仿真方法综述
Review of Mechanical Simulation Methods for 3D Integrated Circuit Packaging
摘要
Abstract
With the continuous increase in chip integration and the ongoing reduction in packaging size,Moore's Law is gradually approaching its physical limits.To continue the development of Moore's Law,traditional two-dimensional planar packaging is gradually evolved towards three-dimensional(3D)packaging.However,due to the complexity and heterogeneity of 3D packaging,as well as differences in the coefficients of thermal expansion(CTE)of different materials within the packaging structure,thermal stress concentrations tend to occur at interfaces under the combined effects of temperature cycling,high operating temperatures,and environmental stress.This can lead to mechanical failures such as solder joint fatigue fracture,through-silicon via(TSV)sidewall cracking,and interlayer delamination.Against this backdrop,3D packaging mechanical simulation technology is recognized as an important means of solving such problems,and the necessity and urgency of related research are increasingly prominent.The existing research methods and latest advancements in mechanical simulation technology for 3D integrated circuit packaging are systematically reviewed.The typical mechanical failure modes of 3D packaging and the corresponding mechanical constitutive models and failure criteria are clarified.The basic principles,applicable scenarios,and technical limitations of the two core simulation methods,namely the finite element method(FEM)and the boundary element method(BEM),are classified and elaborated.Furthermore,the technological evolution logic of multiphysics coupling simulation methods based on FEM and BEM,as well as their application value in complex failure scenarios,are analyzed.The core bottlenecks of the current technical system are summarized,and its future development prospects are prospected.关键词
三维集成电路封装/有限元法/边界元法/多物理场耦合仿真Key words
three-dimensional integrated circuit packaging/finite element method/boundary element method/multi-physics coupling simulation分类
信息技术与安全科学引用本文复制引用
王凤娟,马丁,孙传鸿,尹湘坤,杨媛,余宁梅,余明斌,李言..集成电路三维封装力学仿真方法综述[J].电子与封装,2026,26(3):90-97,8.基金项目
国家自然科学基金(92364101、62274133、U23A20291) （92364101、62274133、U23A20291）
