电子与封装2026，Vol.26Issue(3)：98-107,10.DOI:10.16257/j.cnki.1681-1070.2026.0112
塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究
Study on the Effect of Encapsulation Material Properties on the Thermo-Mechanical Behavior of SiC Fan-Out Panel-Level Packaging
摘要
Abstract
The high power density and miniaturization trend of SiC devices make the thermo-mechanical properties of epoxy molding compound(EMC)a critical factor determining device performance and reliability.This challenge is particularly pronounced in advanced fan-out panel-level packaging(FOPLP)designs,where the EMC not only serves as insulation but also functions as the primary structural support and a barrier to heat dissipation.To investigate the specific influence patterns of different EMCs on the thermo-mechanical properties of FOPLP,two commercially available EMC systems with distinct filler compositions are selected as research subjects.Their key thermo-mechanical properties are systematically characterized.Subsequently,thermal resistance and thermal warpage experiments are conducted to reveal how material variations affect changes in packaging performance.Simultaneously,a thermo-mechanically coupled finite element analysis(FEA)simulation model of the FOPLP structure is established for simulation validation.The final impact of different EMC types on packaging performance is analyzed,and the accuracy of the constructed FEA simulation model is validated.The research findings demonstrate that the Al2O3-filled EMC exhibits superior thermal resistance and thermal warpage characteristics compared to the SiO2-filled EMC.The constructed FEA model accurately predicts the thermo-mechanical behavior of the package,validating the effectiveness of this integrated experiment-simulation evaluation approach.关键词
SiC扇出型板级封装/环氧塑封料/热-机械性能/热阻/翘曲Key words
SiC fan-out panel-level packaging/epoxy molding compound/thermo-mechanical properties/thermal resistance/warpage分类
信息技术与安全科学引用本文复制引用
吴奥洲,李雯钰,杜伟,陈俊伟,佘乃东,宋关强,樊嘉杰..塑封材料特性对SiC扇出型板级封装热-机械行为的影响研究[J].电子与封装,2026,26(3):98-107,10.基金项目
国家自然科学基金(52275559) （52275559）
