电子元件与材料2026，Vol.45Issue(4)：376-386,11.DOI:10.14106/j.cnki.1001-2028.2026.1498
热敏陶瓷材料研究进展
Research progress of thermosensitive ceramic materials
摘要
Abstract
Thermosensitive ceramics,as crucial functional ceramic materials,have been widely applied in electronics,power systems,new energy technologies,and aerospace equipment due to their high stability,excellent temperature sensitivity and low preparation costs.Typical thermosensitive ceramics include positive temperature coefficient(PTC)and negative temperature coefficient(NTC)types,which are primarily investigated in the form of perovskite and spinel structural materials.This review systematically summarizes the conduction mechanisms,materials system design,defect engineering strategies,fabrication processes,and metallization technologies development of PTC and NTC ceramics.Although different crystal structures and material systems exhibit distinct conduction behaviors and temperature-range advantages,they share common principles in doping modulation,structural design,and sintering optimization,enabling effective enhancement of performance across different systems.The development of high-entropy materials with multiple principal elements,advanced densification technologies and highly reliable metallization processes is essential to meet future demands for extreme-temperature operation,wide-temperature-range sensing,long-term stability and device integration.关键词
热敏陶瓷/PTC/综述/NTC/钙钛矿/尖晶石Key words
thermosensitive ceramics/PTC/review/NTC/perovskite/spinel分类
信息技术与安全科学引用本文复制引用
张振业,兰贵天,贺俊,王建,吴隆文..热敏陶瓷材料研究进展[J].电子元件与材料,2026,45(4):376-386,11.基金项目
四川大学-遂宁校市合作专项资金(2024CDSN-06) （2024CDSN-06）
