电子元件与材料2026，Vol.45Issue(4)：398-405,413,9.DOI:10.14106/j.cnki.1001-2028.2026.1440
基于LTCC的内嵌金属柱微流道结构设计研究
Research on the design of microfluidic channel structures with embedded metal pillars based on LTCC
江宇翔 1刘赣 2邢孟江 3李小珍 4杨圆圆2
作者信息
- 1. 电子科技大学 电子科学与工程学院,四川成都 611731
- 2. 电子科技大学长三角研究院(湖州),浙江湖州 310031
- 3. 电子科技大学 电子科学与工程学院,四川成都 611731||电子科技大学长三角研究院(湖州),浙江湖州 310031
- 4. 昆明学院 信息技术学院,云南 昆明 650500
- 折叠
摘要
Abstract
With the rapid development of electronic devices toward high power density and miniaturization,efficient chip heat dissipation has emerged as a critical technical bottleneck limiting their performance and reliability.Microchannel cooling technology has garnered significant attention due to its superior heat dissipation capability.In this study,a microchannel structure with embedded metal pillars based on low-temperature co-fired ceramic(LTCC)was proposed.The effects of the spatial arrangement,cross-sectional shape,and size of the metal pillars,as well as the inlet flow velocity,on the heat dissipation performance and pressure drop of microchannel structures were systematically investigated via multiphysics simulations.The results demonstrated that introducing the circular metal pillar arrays and increasing the inlet flow velocity can significantly enhance the heat dissipation efficiency.The optimal cooling effect can be achieved when the metal pillar diameter accounts for 40％ of the channel width,which reduced the chip temperature by more than 6.4％compared with the microchannel structure without embedded metal pillars.Notably,the proposed gradient non-uniform pillar arrangement strategy not only effectively improves pressure drop characteristics but also further reduces the maximum chip temperature by 1.1％ compared with the traditional uniform arrangement.This work provides a novel solution for addressing the inherent trade-off between heat dissipation and pressure drop in microchannels.关键词
低温共烧陶瓷/微流道/内嵌金属柱/梯度排布/热阻/压降Key words
LTCC/microfluidic channel/embedded metal pillar/gradient arrangement/thermal resistance/pressure drop分类
信息技术与安全科学引用本文复制引用
江宇翔,刘赣,邢孟江,李小珍,杨圆圆..基于LTCC的内嵌金属柱微流道结构设计研究[J].电子元件与材料,2026,45(4):398-405,413,9.
