电子与封装2026，Vol.26Issue(4)：1-6,6.DOI:10.16257/j.cnki.1681-1070.2026.0033
一种基于HTCC工艺的T/R组件用一体化CBGA外壳
Integrated CBGA Housing for T/R Components Based on the HTCC Process
摘要
Abstract
Based on the high-temperature co-fired ceramic(HTCC)process,an integrated ceramic ball grid array(CBGA)housing applied to transmitter/receiver(T/R)component packaging within 8-12 GHz is designed to achieve the miniaturization,high-integration,and low-cost requirements of component packaging.In terms of microwave port design,according to the theory of coplanar waveguide and coaxial line,HFSS software is used to simulate and optimize the microwave transmission structure,and the physical port test results show that,within the 8-12 GHz frequency range,|S21|＜0.2 dB and|S11|＞20 dB.In terms of structural design,the housing structure is optimized by using ABAQUS software to improve the dimensional design.After high-temperature brazing,flatness of the bottom spherical surface is ≤ 60 μm,the pull-off and shear strength of the solder balls are both ≥3.5 N,meeting the requirements for subsequent board-level applications.关键词
HTCC/CBGA外壳/微波端口设计/结构设计Key words
HTCC/CBGA housing/microwave port design/structural design分类
信息技术与安全科学引用本文复制引用
邵金涛,颜汇锃,戴雷,谢新根..一种基于HTCC工艺的T/R组件用一体化CBGA外壳[J].电子与封装,2026,26(4):1-6,6.
