电子与封装2026，Vol.26Issue(4)：7-13,7.DOI:10.16257/j.cnki.1681-1070.2026.0036
热循环载荷下BTC器件焊点应力分析与优化
Stress Analysis and Optimization of Solder Joints of BTC Devices Under Thermal Cyclic Loading
吴松 1张可 1梁威威 1谢颖1
作者信息
- 1. 四川九洲电器集团有限责任公司,四川绵阳 621000
- 折叠
摘要
Abstract
Two PCB pads with different sizes and layouts are designed for bottom termination components(BTCs),and corresponding finite element models of BTC solder joints are established.Through finite element simulations and metallographic tests,the influences of pad design schemes and solder joint structural parameters on the stress of BTC solder joints under thermal cyclic loading are investigated.An orthogonal experimental design method is employed to formulate nine groups of BTC solder joint schemes with different combinations of solder joint length,width,and height parameters.The results demonstrate that the maximum stress of BTC solder joints based on pad type Ⅱ is lower,indicating that this pad design is superior.Solder joint height exhibits a significant effect on the maximum stress of solder joints,whereas the effects of solder joint length and width are insignificant.Consequently,the structural optimization of BTC solder joints is ultimately achieved.关键词
BTC器件焊点/有限元仿真/金相试验/焊盘设计/正交试验设计法Key words
BTC solder joint/finite element simulation/metallographic test/pad design/orthogonal experimental design method分类
信息技术与安全科学引用本文复制引用
吴松,张可,梁威威,谢颖..热循环载荷下BTC器件焊点应力分析与优化[J].电子与封装,2026,26(4):7-13,7.
