电子与封装2026，Vol.26Issue(4)：21-27,7.DOI:10.16257/j.cnki.1681-1070.2026.0039
半导体晶圆键合力控制技术的研究进展与挑战
Research Progress and Challenges of the Force Control Technology in Semiconductor Wafer Bonding
摘要
Abstract
The research status and development trend of the force control technology in semiconductor wafer bonding are reviewed.The basic principles and classification of wafer bonding are introduced,and the key role of bonding force in the wafer bonding process is analyzed.The main factors influencing the bonding force are elaborated in detail,including the parameters of surface morphology,cleanliness,chemical treatment,temperature,and pressure.The mechanical control methods for typical bonding techniques are mainly discussed,such as direct bonding,anodic bonding,and adhesive bonding.The key technologies of interface characterization and bonding force measurement are also presented.The force control challenges of wafer bonding are further analyzed,and the development directions are proposed,thereby providing a reference for the optimization of bonding processes in the semiconductor manufacturing field.关键词
半导体制造/晶圆键合/键合力控制/工艺优化Key words
semiconductor manufacturing/wafer bonding/bonding force control/process optimization分类
信息技术与安全科学引用本文复制引用
张慧,郑志伟,张辉,王成君..半导体晶圆键合力控制技术的研究进展与挑战[J].电子与封装,2026,26(4):21-27,7.基金项目
国家重点研发计划(2022YFB3404300) （2022YFB3404300）
国家自然科学基金青年科学基金项目(52405304) （52405304）
智能机器人湖北省重点实验室项目(HBIR202303) （HBIR202303）
