电子与封装2026，Vol.26Issue(4)：28-33,6.DOI:10.16257/j.cnki.1681-1070.2026.0040
温度循环载荷下功率器件失效机理研究
Research on Failure Mechanisms of Power Devices Under Temperature Cycling Loads
谢林毅 1粟浪 1程佳 2黄青树 1冉亮2
作者信息
- 1. 润西微电子(重庆)有限公司,重庆 400060
- 2. 华润微电子(重庆)有限公司,重庆 400060
- 折叠
摘要
Abstract
Power devices are the core components of power electronic systems,and their reliability is crucial.Current research on the failure mechanisms of power devices under temperature cycling(TC)loads is still insufficient.Therefore,a method combining experimental characterization with failure mechanism analysis is adopted to investigate the failure modes and mechanisms of power devices under temperature cycling loads,which provides a theoretical foundation and technical reference for the reliability design and lifetime prediction of subsequent power devices.The principles,objectives,and methods of the TC test are introduced.The devices are subjected to the TC test,and electrical parameter data are collected.Failure analysis on electrically failed devices reveals that cracks in the passivation layer allow moisture to penetrate the chip interior,ultimately leading to thermal breakdown of the devices.Corresponding improvement strategies for the passivation layer are proposed from both material and process perspectives,providing technical guidance for product development.关键词
温度循环试验/功率器件/可靠性/失效机理Key words
temperature cycling test/power devices/reliability/failure mechanisms分类
信息技术与安全科学引用本文复制引用
谢林毅,粟浪,程佳,黄青树,冉亮..温度循环载荷下功率器件失效机理研究[J].电子与封装,2026,26(4):28-33,6.
