电子与封装2026，Vol.26Issue(5)：1-6,6.DOI:10.16257/j.cnki.1681-1070.2026.0048
硅基射频微系统的传热及热-力耦合仿真研究
Heat Transfer and Thermo-Mechanical Coupling Simulation in Silicon-Based RF Microsystems
摘要
Abstract
As the core components of information transmission and reception,RF microsystems play an important role in the precise transmission of information.With the trend of electronic devices towards miniaturization,high-density integration and high power density,RF microsystems have become mainstream products with their advantages of high performance,high reliability and low cost.Due to the small size and high power density of RF microsystems,the heat dissipation problem during operation becomes more and more prominent,which seriously affects their reliability.Therefore,finite element simulation can be used to predict the reliability of such systems under opercrtion to optimize the design.Taking an RF microsystem developed via 3D heterogeneous integration as an example,its heat transfer and thermo-mechanical coupling characteristics are analyzed using finite element simulation,and its thermal and mechanical performance under operation is predicted.This approach effectively avoids design risks and provides support for the high-reliability design of such systems.关键词
硅基射频微系统/热-力耦合/有限元仿真/三维异构集成Key words
silicon-based RF microsystem/thermo-mechanical coupling/finite element simulation/3D heterogeneous integration分类
信息技术与安全科学引用本文复制引用
孙浩洋,高一睿,姬峰,兰梦伟,王成伟,韩宇,张鹏哲,郭振华..硅基射频微系统的传热及热-力耦合仿真研究[J].电子与封装,2026,26(5):1-6,6.基金项目
国家自然科学基金"叶企孙"科学基金(U2141218) （U2141218）
