电子与封装2026，Vol.26Issue(5)：23-30,8.DOI:10.16257/j.cnki.1681-1070.2026.0056
射频异构微系统集成技术综述
Review of RF Heterogeneous Microsystem Integration Technology
孙世凯 1陈雷 1冯长磊 1赵轩1
作者信息
- 1. 北京微电子技术研究所,北京 100076
- 折叠
摘要
Abstract
With the continuous advancement of semiconductor and packaging processes,radio frequency(RF)microsystems are evolving toward high integration,low cost,and high performance,making their integration technologies a hot topic of research in both academia and industry.The development of integration technologies such as wire bonding,flip chip,2.5D,and 3D provides strong support for enhancing the performance and functional density of RF microsystems.Based on fundamental integration technologies for RF microsystems,the latest research progress in various hybrid heterogeneous integration technologies is systematically reviewed,comparative analysis and discussion of these technologies are conducted,and a summary and outlook are provided.关键词
射频微系统/引线键合/倒装/集成技术Key words
RF microsystem/wire bonding/flip chip/integration technology分类
信息技术与安全科学引用本文复制引用
孙世凯,陈雷,冯长磊,赵轩..射频异构微系统集成技术综述[J].电子与封装,2026,26(5):23-30,8.
