电子与封装2026，Vol.26Issue(6)：1-7,7.DOI:10.16257/j.cnki.1681-1070.2026.0067
混合集成电路用AlN-AMB基板电容焊接可靠性研究
Soldering Reliability of Capacitors on AlN-AMB Substrates for Hybrid Integrated Circuits
摘要
Abstract
Based on the finite element simulation method,a thermo-mechanical coupling model is established to systematically investigate the influence of ceramic substrate material,pad geometric parameters,conductor layout pattern,distribution of copper-clad regions,and ceramic substrate thickness on the root stress of the soldered capacitor.The research results indicate that,compared with the Al2O3 direct-bonded copper(Al2O3-DBC)substrate,the larger coefficient of thermal expansion(CTE)mismatch between the AlN ceramic and the BaTiO3 capacitor is the key factor leading to a 56.8％increase in the root stress of the capacitor soldered on the AlN active-metal-brazed copper(AlN-AMB)substrate.By optimizing the pad dimensions of the capacitor,the root stress of the capacitor is reduced by 40.5％.Moreover,through the rational layout of conductor traces and the positional relationship of copper-clad regions,the stress at the capacitor root is effectively mitigated.The revealed influence laws of stress and the proposed optimization design method provide theoretical support for the design of AlN-AMB substrates for high-reliability hybrid integrated circuits.关键词
热机械应力/有限元分析/可靠性优化Key words
thermo-mechanical stress/finite element analysis/reliability optimization分类
信息技术与安全科学引用本文复制引用
董晓伟,董布克,王睿,赵斯阳..混合集成电路用AlN-AMB基板电容焊接可靠性研究[J].电子与封装,2026,26(6):1-7,7.基金项目
安徽省科技创新攻坚计划(202423i08050002) （202423i08050002）
