电子与封装2026，Vol.26Issue(6)：26-31,6.DOI:10.16257/j.cnki.1681-1070.2026.0068
CSOP焊点形态对热疲劳寿命的影响与优化
Effect of CSOP Solder Joint Morphology on Thermal Fatigue Life and Its Optimization
郭智鹏 1张少华 2李冰晨 2何文多2
作者信息
- 1. 西安恒翔控制技术有限公司,西安 710071||中国航空工业集团西安飞行自动控制研究所,西安 710071
- 2. 中国航空工业集团西安飞行自动控制研究所,西安 710071
- 折叠
摘要
Abstract
The ceramic small outline package(CSOP)solder joint is taken as the research object,and the influence of solder wicking height and solder filling volume at the lead root in the soldering process on solder joint life is analyzed.Based on finite element simulation and combined with the Coffin-Manson life prediction model,the effect of different solder joint morphologies on solder joint reliability is analyzed.The results show that solder wicking significantly weakens the deformation buffering capacity of the lead bending structure:when the solder wicking height exceeds the first and second bends of the lead,respectively,the thermal fatigue life of the solder joint is reduced by 3.95％and 49.30％.As the solder filling volume at the lead root is increased from 0.025 21 mm3 to 0.041 08 mm3,stress concentration is effectively relieved by the formation of a full fillet,and the thermal fatigue life of the solder joint is thus increased by as much as 366.97％.A theoretical basis and optimization direction are provided for formulating process parameters related to solder joint morphology.关键词
陶瓷小外形封装/热疲劳寿命/焊锡爬升Key words
ceramic small outline package/thermal fatigue life/solder wicking分类
信息技术与安全科学引用本文复制引用
郭智鹏,张少华,李冰晨,何文多..CSOP焊点形态对热疲劳寿命的影响与优化[J].电子与封装,2026,26(6):26-31,6.
