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脱模剂对基板类单面封装质量及塑封料关键性能的影响

蔡晓东 周凯

电子与封装2026,Vol.26Issue(6):39-42,4.
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电子与封装2026,Vol.26Issue(6):39-42,4.DOI:10.16257/j.cnki.1681-1070.2026.0090

脱模剂对基板类单面封装质量及塑封料关键性能的影响

Effect of Release Agents on the Quality of Single-Sided Encapsulation of Substrates and Key Properties of Epoxy Molding Compounds

蔡晓东 1周凯1

作者信息

  • 1. 上海道宜半导体材料有限公司,上海 201413
  • 折叠

摘要

Abstract

To optimize the appearance quality and continuous operability of epoxy molding compounds for single-sided encapsulation of substrates,the effects of natural wax A,synthetic wax B and their blended system on the fundamental properties and release force of the molding compounds are investigated.Three experimental groups are designed;the effects of release agent types on key properties of the molding compounds are systematically analyzed through gelation time tests,spiral flow length tests,melt viscosity tests,release force tests,disc simulation,and continuous operability verification of single-sided encapsulation.Results indicate that no significant difference is observed in the effects of the three systems on gelation time;natural wax A reduces the melt viscosity of the molding compounds,improves flowability and decreases release force,but tends to cause surface flow marks;synthetic wax B exhibits poorer release performance;the blended system demonstrates the best overall performance,balancing good flowability,appearance integrity,and excellent continuous operability.

关键词

环氧塑封料/脱模剂/基板类单面封装/连续作业性/外观质量

Key words

epoxy molding compound/release agent/single-sided encapsulation of substrates/continuous operability/appearance quality

分类

信息技术与安全科学

引用本文复制引用

蔡晓东,周凯..脱模剂对基板类单面封装质量及塑封料关键性能的影响[J].电子与封装,2026,26(6):39-42,4.

电子与封装

1681-1070

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