电子元件与材料2026，Vol.45Issue(8)：951-958,8.DOI:10.14106/j.cnki.1001-2028.2026.0016
添加Mg对Sn-9Zn-3Bi钎料显微组织及性能的影响
Effect of Mg addition on the microstructure and properties of Sn-9Zn-3Bi solder
摘要
Abstract
Alloying is a crucial approach for developing new solders.To investigate the effects of Mg addition on the microstructure,melting point,wettability,oxidation resistance,hardness,and intermetallic compound(IMC)layer formation at the Sn-9Zn-3Bi/Cu joint interface,Sn-9Zn-3Bi lead-free solder was selected as the base material and was alloyed with trace amounts of Mg.Results showed that as the Mg content increased,the melting point of the Sn-9Zn-3Bi solder decreased,while its spreading area on the Cu substrate initially increased and then decreased.Notably,the addition of Mg significantly improved the solder's oxidation resistance.Microstructural analysis revealed that the solder primarily consists of β-Sn phases,granular Bi-rich phases,short needle-like β-Sn/Zn-rich eutectic phases,and coarse needle-shaped Zn-rich phases.As the Mg content increased,the microstructure underwent a transition from refinement to coarsening,resulting in a corresponding increase followed by a decrease in hardness.Although the introduction of Mg did not alter the type of IMC layer at the joint interface,the thickness of the IMC layer first decreased and then increased with increasing Mg content.When the Mg mass fraction reaches 0.05%,the solder achieved an optimal balance among all performance parameters.关键词
Sn-9Zn-3Bi钎料/熔点/Mg/显微组织Key words
Sn-9Zn-3Bi solder/melting point/Mg/microstructure分类
矿业与冶金引用本文复制引用
涂文斌,徐江明,郭昭阳,李如君,王善林,陈玉华,毛隆辉..添加Mg对Sn-9Zn-3Bi钎料显微组织及性能的影响[J].电子元件与材料,2026,45(8):951-958,8.基金项目
江西省重点研发计划(20252BCE310036) （20252BCE310036）
